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Screen Printer

Rapid thermal process oven(RTP-1000-150)
 

RTP vacuum process oven for inert gases
Single wafer proessing for up to 150mm wafer size.
Key features are precise controlled fast ramp-up and ramp- down rates.
Space saving multipurpose table top unit with front loading drawer for the following


Applications

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ü ο ݵü μ

ü Ÿ

ü ǰ ˼/ о

ü .ð ׽Ʈ/ùķ̼

ü ޼ μ

ü SiAu, SiAl, SiMo alloying

ü low k dielectrics

ü post implanting annealing

ü copper past firing

ü resistor paste firing 
 
ü LTO
 




Specification

Model

  RTP-1000-150

Process chamber

50mm up to 150mm wafer size

Heater

Infrared Lamps, 18 kW

Heating

top and bottom heating

Loading system

quartz glass tray in the process chamber

Loading area

150mm wafer size

Controller

fast PID temperature process controller

temperature step

100 steps programmable

Program Memory

20 programs

Vacuum

external pump

Temperature range

room temperature up to 700 C (long lasting)

Max. Temperature

1000 C

Ramp up rate

free programmable, max. 75 K/second

Ramp down rate

T=600C up to 400C max. 20K/min

Electricity

CEE 3x32A, 230V, 3 Phase

Cooling

Water cooling required (option)

Power

22OV 60Hz

Inlet pressure

2 to 6 bar, Minimum DP 2 bar

Interface

USB

Dimension

555x460x520 (WxHxD)

Weight

45 kg