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Screen Printer

Convection Reflow Oven
 

High Performance reflow batch oven 

- Reflow ùķ̼

- ǰ µ TEST(ִµ 350)

- ǰ ҷ

 High Operating Temperature for Lead Free Soldering

- Max Temp 350

- N2 gas or Air

 Small Desktop Size

- ȿ ǵ

- ŷڼ

 Large Glass Viewing Window

- â(280X280mm) ä

- ̰ ̿Ͽ soldering

- ŷڼ ڷ ȹ濡

 Large Backlit LCD Digital Display

-

- µ Ȯ

- 255 ޸ 尡

Specifications

Model

X-Reflow 306

Reflow area

305x305x45 mm

Temperature range

70C to 350C

Temperature Zones

Preheat1, 2, 3 Reflow, Cooling  5 zones

Heaters

2 Heaters (Front and Rear) 2,4kW

Max. PCB size

305 X 305 mm

Power

220V 50/60 Hz 5 kW

Cooling Cycle

1 Zone

Window Size

280280 mm

Nitrogen  

Nitrogen pressure:1/2-1bar (7-14.5 psi)

Size

480(L) X 711(W) X 200(H) mm

Weight

40 kg

Profile

255 Programs

PC control

RS485 port







Full Forced Air Convection Oven

- 1 ZONE Hot Air Heating 3zone profile

- Soldering(Reflow zone) View Function(Window)

Lead-Free Soldering

- N2 gas (option)

Good performances

- ǰ ɴ ո

- Soldering

- LCD controller

- д 90C . Component baking

- Soldering ˶ Բ switch-off ۵

Low power consumption, high productivity and easy-of-use.

Specification

Model

TWS850 (HOT AIR/ N2 GAS)

Dimension

695 X 540X 410 (mm)

Weight

25kg

Power

220V 60Hz

Heating zone

Hot Air 1zone

Cooling zone

Door open

power consumption

Average 1 kw – Max 5kw

power

220V 60Hz

Maxi component height

200mm