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Screen Printer

Die Bonder
 

Pick & Place

Flip chip assembly
very small and large components, IC, capa-chips,
resistor chip...
Standard Applications:
MEMS, MMIC, Opto or IR Sensor, Laser diodes, strength gage

Specification

Model

P P 5

Accuracy

Up to 5 µm, Up to 1 µm (option flip)

  Die Size

minimum 200X200µm ~maximum 50X50mm

Substrate size

Max 150x500mm

Part fixture

Vacuum or Clamp

Motorized Tables

X: 240 mm , Y: 90 mm , Manual theta.

Speed

Control by joystick

Table resolution

1 µm

Digital Target

Generator

Alignment

Manual with color CCD

Optical Zoom

X 12

Placement

2 references points for auto-centering

Parameters

On LCD screen

Bond force

Programmable 10g up to 3 000 g

Bond Time

Programmable 0 up to 999 s

Scrub

X. Y and number

Vacuum

Selectable on or off during bond

Temperature

Programmable 0 up to 400(option eutectic)

Work height

Adjustable / Soft touch down speed

Options

Ultrasonic die bonding, Au SnPb

Dispenser for glue or solder paste

Stamping capability

Dipping on Flux

Reflow, thermal cycle is programmable

Eutectic, thermal cycle is programmable

Gas environment for high temp. cycle

Hot Gas Jet, for local eutectic (multiple die eutectic)

Wafer sorter 4", 6", 8"